ACM Research ships first 310×310 mm panel-level horizontal electroplating tool to a customer in Asia
The Ultra ECP ap-p tool shipped in October; ACM says large size AI chips drive more complex 2.5D and 3D packaging requirements. It follows last year's shipment of a first 515 × 510 mm R&D tool.
ACM ResearchACM Research (Shanghai), Inc. Source: ACM Research, Inc. 8-K, filed Nov 5, 2026