ChipsDeal
GF enters multi-year $2 billion agreement with TSMC for U.S.-made silicon interposers for CoWoS packaging
GF will add manufacturing capacity at its Malta, New York facility, with volume production expected to begin ramping in the first half of 2028. The agreement supports growing demand for AI and high-performance computing systems.
- Size
- $2 bn
- Place
- Malta, New York
- Source
- GLOBALFOUNDRIES Inc. 6-K, filed Nov 4, 2026
- Published here
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