ChipsAnnouncement
TSMC board approves capital appropriations of approximately US$40,926.70 million for advanced technology and advanced packaging capacity
Appropriations are to meet long-term capacity plans based on market demand forecasts and the technology roadmap. Purposes include advanced technology capacity, advanced packaging, mature and specialty capacity, fab construction, facility systems, 2027 R&D capital investments, sustaining capex and capitalized leased assets.
- Size
- $40,926.7 mn
- Companies
- TSMC
- Source
- Taiwan Semiconductor Manufacturing Co Ltd 6-K, filed Nov 10, 2026
- Published here
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